1. 2. 3. material content data sheet sales product name bts443p issued 29. august 2013 ma# MA000267886 package pg-to252-5-11 weight* 358.07 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 6.289 1.76 1.76 17564 17564 leadframe non noble metal iron 7439-89-6 0.205 0.06 571 inorganic material phosphorus 7723-14-0 0.061 0.02 171 non noble metal copper 7440-50-8 204.243 57.03 57.11 570397 571139 wire non noble metal aluminium 7429-90-5 1.917 0.54 0.54 5353 5353 encapsulation organic material carbon black 1333-86-4 1.359 0.38 3797 plastics epoxy resin - 23.791 6.64 66442 inorganic material silicondioxide 60676-86-0 110.798 30.94 37.96 309428 379667 leadfinish non noble metal tin 7440-31-5 5.072 1.42 1.42 14166 14166 plating non noble metal nickel 7440-02-0 0.076 0.02 213 inorganic material phosphorus 7723-14-0 0.000 0.00 0.02 1 214 glue plastics polyimide 26023-21-2 0.132 0.04 0.04 368 368 solder noble metal silver 7440-22-4 0.103 0.03 288 non noble metal tin 7440-31-5 0.083 0.02 231 non noble metal lead 7439-92-1 3.942 1.10 1.15 11010 11529 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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